Keynote & Invited Speakers
Keynote Speakers
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Session 1
Innovations of Innovations In Photomasks
- Jed H. Rankin (GlobalFoundries, USA)
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Session 8
New opportunities for mask data preparation during time of unprecedented advances in semiconductor technology and demand
- Srinivas Raghvendra (Synopsys, Inc., USA)
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Session 13
Advanced and Affordable EUV Lithography with Deep-Dive Mitigation of ML Defects
- Yoshihiro Tezuka (Intel K.K., Japan)
Invited speakers
Session 1
ICAPS Market Trends and Key Inflections Driving Growth in the Semiconductor Equipment Segment
- Shiva Rai (Applied Materials, Inc., USA)
Session 3
EUV mask blanks review
- Yoshiaki Ikuta (AGC Inc., Japan)
Development of EUV blanks -- History and future challenge--
- Takahiro Onoue (HOYA Corporation, Japan)
Session 4
The current status of nano-imprint lithography and its future outlook toward carbon neutrality by 2050
- Tetsuro Nakasugi (Kioxia Corporation, Japan)
Session 5
Optical Metasurfaces for Advanced Imaging
- Masashi Miyata (NTT Device Technology Laboratories, Japan)
Nanostructured Plasmonic Metasurface Gives a "Hand" to Chiral Self-Assembly
- Hiromasa Niinomi (Tohoku University, Japan)
Session 6
High-NA EUVL Exposure Tool: Program Progress and Mask Interaction
- Jan van Schoot (ASML Netherlands B.V., Netherlands)
EUV Optics in high volume manufacturing
- Christian Karlewski (Carl Zeiss SMT GmbH, Germany)
Session 7
The EUV mask exposed
- Vicky Philipsen (IMEC, Belgium)
Session 9
Status of 'Curvilinear data format' working group
- Jin Choi (Samsung Electronics Co Ltd., Korea)
Session 12
SEM Based Photo Mask Repair
- Klaus Edinger (Carl Zeiss SMT GmbH, Germany)
Session 13
10th Annual eBeam Initiative Survey Reports Photomask Market Optimism
- Aki Fujimura (D2S, Inc., USA)
Session 14
Actinic patterned mask defect inspection for EUV lithography
- Tsunehito Kohyama (Lasertec Corporation, Japan)
Session 16
Characterization of mask CD mean-to-target for hotspot patterns by using SEM image contours
- Kan Zhou (Shanghai Huali Integrated Circuit Corporation, China)
Session 17
Multi-beam Mask Writer Technology Taking The Next Step
- Mathias TOMANDL (IMS Nanofabrication GmbH, Austria)