On-demand / Poster materials

Opening Session: Day 1

1-1
(Keynote)
Status and challenges of high NA EUV ECO-system

Kurt Ronse
(imec, Belgium)

1-2
(Invited)
Applications of EUV Metrology Tools

Matt Hettermann
(EUV Tech, USA)

1-3Using X-ray fluorescence as an independent metrology of layer thickness and intermixing in reflective EUV multilayers

Ashish Kulkarni
(Veeco Instruments, USA)

EUV Inspection & Repair

2-1
(Invited)
Actinic patterned mask inspection for EUV Lithography

Toshiyuki Todoroki
(Lasertec, Japan)

2-2Progress Report on Actinic Patterned Mask Inspection for EUVL

Safak Sayan
(Intel Corporation, USA)

2-3
(Invited)
In-line Scanning Probe Technologies for Mask Defect Inspection and Repair

Sang-Joon Cho
(PARK SYSTEMS, Korea)

2-4AFM clean and nanomachining repair technology for future mask nodes

Tod Robinson
(Bruker BNSM RMR, USA)

NIL 1

3-1
(Invited)
TELs Patterning Technologies for Next Generation Lithography Using Nanoimprint Lithography

Tomohito Yamaji
(Tokyo Electron Ltd., Japan)

3-2Development of Nanoimprint Templates for Dual Damascene Processing

Hisayoshi Watanabe
(Dai Nippon Printing Co., Ltd., Japan)

3-3Nanoimprint Performance Improvements for High Volume Semiconductor Device Manufacturing

Hiromichi Hara
(Canon Inc., Japan)

3-4Nanoimprint Post Processing Techniques to Address Edge Placement Error

Go Tsuchiya
(Canon Inc., Japan)

NIL 2

4-1
(Invited)
Nanoimprint_From Sinlge DIE to Wafer Level

Christine Thanner
(EV Group, Austria)

4-2Simulation of Fluorescence Alignment with Atomic-Scale Precision for Ultraviolet Nanoimprint Lithography

Hiromasa Niinomi
(Tohoku University, Japan)

4-3Ultra-High Throughput Electron Beam Lithography for Wafer Size Nanoimprint Mold Fabrication

Takaomi Ito
(Elionix Inc., Japan)

4-4Nanoimprint and nanoprint processes using Seamless Roller Mold

Makoto Okada
(Asahi Kasei Corp., Japan)

EUV Lithography & Source

5-1
(Invited)
High NA EUV: Progress update and mask impact

Jan van Schoot
(ASML Netherlands B.V., Netherlands)

5-2Reducing systematic LCDU of dense contact hole arrays on wafer via source optimization

Joern-Holger Franke
(imec, Belgium)

5-3High-brightness LDP source

Kazuya Aoki
(USHIO INC., Japan)

5-4Modeling of the emission spectrum from Sn to rare-earth elements for the Extreme Ultra-Violet Lithography

Akira Sasaki
(National Institutes for Quantum Science and Technology, Japan)

Opening Session: Day 2

6-1
(Keynote)
Holistic Approaches Toward High NA EUV Lithography

Seiji Nagahara
(Tokyo Electron Ltd., Japan)

6-2Exploring Photomask Etching Capabilities For New EUV Absorber Materials

Rebecca Stern
(Applied Materials, USA)

6-3Study of EB resist dissolution contrast and chemical blur impact on the ultimate resolution

Kei Yamamoto
(FUJIFILM Corporation, Japan)

Mask Data Handling

7-1
(Invited)
The impact of real curve layout in Mask Data Preparation

Masakazu Hamaji
(Nippon Control System Corporation, Japan)

7-2
(Invited)
You don't need 1nm contours for curvilinear shapes: Pixel-based computing is the answer

Abhishek Shendre
(D2S, Inc., USA)

7-3New Multi-Beam Mask Data Preparation Method for EUV High Volume Data

Kyungsup Shin
(Samsung Electronics Co., Ltd., Korea)

7-4
Canceled
Application of SONR for a better OPC model for EUV curvilinear photomask

Chih-I Wei
(Siemens Digital Industries Software, Belgium)

Poster Session

8-1Super Smoothing of Nanoscale Quartz Surface Using Amorphous Carbon Films

Abdelrahman Farghali
(The University of Tokyo, Japan)

8-2Evaluation of suprathermal ions in a laser-produced plasma beyond-EUV source

Takeru Niinuma
(Utsunomiya University, Japan)

8-3Property of Amplifier Using Yb:YAG Thin Rod

Shotaro Hirao
(Utsunomiya University, Japan)

8-4Carbon/Boron Multilayer for Beyond EUV Lithography

Umi Fujimoto
(University of Hyogo, Japan)

8-5
Canceled
The process-footprint and density-dependent errors correction of laser mask pattern generator with software-based data path for CD uniformity improvement

Yen-Hao Chen
(Taiwan Mask Corporation, Taiwan)

8-6Application of Pattern Matching on Single Die Photomask for AIMS Reference Image Searching

Fei Lin Liu
(Taiwan Mask Corporation, Taiwan)

8-7Sidewall angle calculation on CDSEM metrology

WenWei Lee
(Taiwan Mask Corporation, Taiwan)

8-8A Study of Photomask Manufacture Process based on AI Technology

Hiroshi Nakata
(Dai Nippon Printing Co., Ltd., Japan)

Sponsor Session

Laser writer for today and future

Mycronic Technologies Corporation

EUV Technologies

9-1
(Invited)
Spatial frequency breakdown of CD variation

Tatiana Kovalevich
(imec, Belgium)

9-2
(Invited)
ZEISS AIMS EUV High NA for Actinic Mask Review with EXE:5000 Scanner Emulation

Klaus Gwosch
(Carl Zeiss SMT GmbH, Germany)

9-3Imaging performance of low-n absorbers at the optical resolution limits of high NA EUV systems

Andreas Erdmann
(Fraunhofer IISB, Germany)

Opening Session: Day 3

10-1
(Invited)
11th eBeam Initiative Survey Reports EUV Fueling Photomask Industry Growth

Aki Fujimura
(D2S, Inc., USA)

10-2New Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber

Yukinobu Hayashi
(CyberOptics Corporation, USA)

10-3Investigation of Mask Impact on Wafer LCDU in ArF Lithography

Itaru Yoshida
(Toppan Photomask Co., Ltd., Japan)

10-4MoSi stain defect reduction in photo resist strip process

Ewin Zhuo
(Photronics DNP Mask Corporation Xiamen, China)

Patterning Technologies

11-1
(Invited)
Pixel-based Data Preparation System for Digital Scanner

Yuho Kanaya
(NIKON CORPORATION, Japan)

11-2Throughput Limits for Ultra-Low Voltage Electron Beam Lithography

Tanj Bennett
(Avant-Gray LLC, USA)

11-3Situation of Stereophonic Lithography Using Parabolic Mirrors

Toshiyuki Horiuchi
(Tokyo Denki University, Japan)

AI Utilization

12-1Automated Measurement Method with Human-pose Estimation Model for Cross-sectional SEM Images of Semiconductor Devices

Yutaka Okuyama
(Hitachi, Ltd., Japan)

12-2Approach to AI Defect Classification for Pahotomask Inspection Equipment Using EOI-AI Software Package Developed by HTL

Hideaki Hamada
(HTL Co. Japan Ltd., Japan)

12-3Applying deep learning methods in flat panel display mask shop operation

Stefan Fu
(Mycronic AB, Sweden)

Writing Tools

13-1
(Invited)
Multi-Beam Mask Writing: A versatile technology from mature to high-end nodes

Annette Schnettelker
(IMS Nanofabrication GmbH, Austria)

13-2Current Performance of Electron Multi-beam Mask Writers and Future Plans toward High-NA EUV Era

Jumpei Yasuda
(NuFlare Technology, Inc., Japan)

13-3DUV Mask Writer addressable to 90nm nodes with a sustainability profile

Robert Eklund
(Mycronic AB, Sweden)
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