On-demand / Poster materials
Opening Session: Day 1
1-1
(Keynote)Status and challenges of high NA EUV ECO-system
- Kurt Ronse
- (imec, Belgium)
1-2
(Invited)Applications of EUV Metrology Tools
- Matt Hettermann
- (EUV Tech, USA)
1-3Using X-ray fluorescence as an independent metrology of layer thickness and intermixing in reflective EUV multilayers
- Ashish Kulkarni
- (Veeco Instruments, USA)
EUV Inspection & Repair
2-1
(Invited)Actinic patterned mask inspection for EUV Lithography
- Toshiyuki Todoroki
- (Lasertec, Japan)
2-2Progress Report on Actinic Patterned Mask Inspection for EUVL
- Safak Sayan
- (Intel Corporation, USA)
2-3
(Invited)In-line Scanning Probe Technologies for Mask Defect Inspection and Repair
- Sang-Joon Cho
- (PARK SYSTEMS, Korea)
2-4AFM clean and nanomachining repair technology for future mask nodes
- Tod Robinson
- (Bruker BNSM RMR, USA)
NIL 1
3-1
(Invited)TELs Patterning Technologies for Next Generation Lithography Using Nanoimprint Lithography
- Tomohito Yamaji
- (Tokyo Electron Ltd., Japan)
3-2Development of Nanoimprint Templates for Dual Damascene Processing
- Hisayoshi Watanabe
- (Dai Nippon Printing Co., Ltd., Japan)
3-3Nanoimprint Performance Improvements for High Volume Semiconductor Device Manufacturing
- Hiromichi Hara
- (Canon Inc., Japan)
3-4Nanoimprint Post Processing Techniques to Address Edge Placement Error
- Go Tsuchiya
- (Canon Inc., Japan)
NIL 2
4-1
(Invited)Nanoimprint_From Sinlge DIE to Wafer Level
- Christine Thanner
- (EV Group, Austria)
4-2Simulation of Fluorescence Alignment with Atomic-Scale Precision for Ultraviolet Nanoimprint Lithography
- Hiromasa Niinomi
- (Tohoku University, Japan)
4-3Ultra-High Throughput Electron Beam Lithography for Wafer Size Nanoimprint Mold Fabrication
- Takaomi Ito
- (Elionix Inc., Japan)
4-4Nanoimprint and nanoprint processes using Seamless Roller Mold
- Makoto Okada
- (Asahi Kasei Corp., Japan)
EUV Lithography & Source
5-1
(Invited)High NA EUV: Progress update and mask impact
- Jan van Schoot
- (ASML Netherlands B.V., Netherlands)
5-2Reducing systematic LCDU of dense contact hole arrays on wafer via source optimization
- Joern-Holger Franke
- (imec, Belgium)
5-3High-brightness LDP source
- Kazuya Aoki
- (USHIO INC., Japan)
5-4Modeling of the emission spectrum from Sn to rare-earth elements for the Extreme Ultra-Violet Lithography
- Akira Sasaki
- (National Institutes for Quantum Science and Technology, Japan)
Opening Session: Day 2
6-1
(Keynote)Holistic Approaches Toward High NA EUV Lithography
- Seiji Nagahara
- (Tokyo Electron Ltd., Japan)
6-2Exploring Photomask Etching Capabilities For New EUV Absorber Materials
- Rebecca Stern
- (Applied Materials, USA)
6-3Study of EB resist dissolution contrast and chemical blur impact on the ultimate resolution
- Kei Yamamoto
- (FUJIFILM Corporation, Japan)
Mask Data Handling
7-1
(Invited)The impact of real curve layout in Mask Data Preparation
- Masakazu Hamaji
- (Nippon Control System Corporation, Japan)
7-2
(Invited)You don't need 1nm contours for curvilinear shapes: Pixel-based computing is the answer
- Abhishek Shendre
- (D2S, Inc., USA)
7-3New Multi-Beam Mask Data Preparation Method for EUV High Volume Data
- Kyungsup Shin
- (Samsung Electronics Co., Ltd., Korea)
7-4
CanceledApplication of SONR for a better OPC model for EUV curvilinear photomask
- Chih-I Wei
- (Siemens Digital Industries Software, Belgium)
Poster Session
8-1Super Smoothing of Nanoscale Quartz Surface Using Amorphous Carbon Films
- Abdelrahman Farghali
- (The University of Tokyo, Japan)
8-2Evaluation of suprathermal ions in a laser-produced plasma beyond-EUV source
- Takeru Niinuma
- (Utsunomiya University, Japan)
8-3Property of Amplifier Using Yb:YAG Thin Rod
- Shotaro Hirao
- (Utsunomiya University, Japan)
8-4Carbon/Boron Multilayer for Beyond EUV Lithography
- Umi Fujimoto
- (University of Hyogo, Japan)
8-5
CanceledThe process-footprint and density-dependent errors correction of laser mask pattern generator with software-based data path for CD uniformity improvement
- Yen-Hao Chen
- (Taiwan Mask Corporation, Taiwan)
8-6Application of Pattern Matching on Single Die Photomask for AIMS Reference Image Searching
- Fei Lin Liu
- (Taiwan Mask Corporation, Taiwan)
8-7Sidewall angle calculation on CDSEM metrology
- WenWei Lee
- (Taiwan Mask Corporation, Taiwan)
8-8A Study of Photomask Manufacture Process based on AI Technology
- Hiroshi Nakata
- (Dai Nippon Printing Co., Ltd., Japan)
Sponsor Session
Laser writer for today and future
- Mycronic Technologies Corporation
EUV Technologies
9-1
(Invited)Spatial frequency breakdown of CD variation
- Tatiana Kovalevich
- (imec, Belgium)
9-2
(Invited)ZEISS AIMS EUV High NA for Actinic Mask Review with EXE:5000 Scanner Emulation
- Klaus Gwosch
- (Carl Zeiss SMT GmbH, Germany)
9-3Imaging performance of low-n absorbers at the optical resolution limits of high NA EUV systems
- Andreas Erdmann
- (Fraunhofer IISB, Germany)
Opening Session: Day 3
10-1
(Invited)11th eBeam Initiative Survey Reports EUV Fueling Photomask Industry Growth
- Aki Fujimura
- (D2S, Inc., USA)
10-2New Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber
- Yukinobu Hayashi
- (CyberOptics Corporation, USA)
10-3Investigation of Mask Impact on Wafer LCDU in ArF Lithography
- Itaru Yoshida
- (Toppan Photomask Co., Ltd., Japan)
10-4MoSi stain defect reduction in photo resist strip process
- Ewin Zhuo
- (Photronics DNP Mask Corporation Xiamen, China)
Patterning Technologies
11-1
(Invited)Pixel-based Data Preparation System for Digital Scanner
- Yuho Kanaya
- (NIKON CORPORATION, Japan)
11-2Throughput Limits for Ultra-Low Voltage Electron Beam Lithography
- Tanj Bennett
- (Avant-Gray LLC, USA)
11-3Situation of Stereophonic Lithography Using Parabolic Mirrors
- Toshiyuki Horiuchi
- (Tokyo Denki University, Japan)
AI Utilization
12-1Automated Measurement Method with Human-pose Estimation Model for Cross-sectional SEM Images of Semiconductor Devices
- Yutaka Okuyama
- (Hitachi, Ltd., Japan)
12-2Approach to AI Defect Classification for Pahotomask Inspection Equipment Using EOI-AI Software Package Developed by HTL
- Hideaki Hamada
- (HTL Co. Japan Ltd., Japan)
12-3Applying deep learning methods in flat panel display mask shop operation
- Stefan Fu
- (Mycronic AB, Sweden)
Writing Tools
13-1
(Invited)Multi-Beam Mask Writing: A versatile technology from mature to high-end nodes
- Annette Schnettelker
- (IMS Nanofabrication GmbH, Austria)
13-2Current Performance of Electron Multi-beam Mask Writers and Future Plans toward High-NA EUV Era
- Jumpei Yasuda
- (NuFlare Technology, Inc., Japan)
13-3DUV Mask Writer addressable to 90nm nodes with a sustainability profile
- Robert Eklund
- (Mycronic AB, Sweden)